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LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry

LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry Featured Image
  • LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry
  • LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry
  • LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry
  • LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry
  • LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry

Short Description:

A silicon wafer grinding wheel is a specialized tool used in the semiconductor industry for thinning and shaping silicon wafers. Silicon wafers are used as a substrate for the fabrication of integrated circuits and other electronic components.


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Grinding Wheels for Photovoltaic Industry

Grinding wheels used for silicon wafer thinning are typically made of diamond abrasive material. Diamond is an extremely hard material that is capable of effectively grinding and shaping silicon, which is also a hard material. The diamond abrasive particles are bonded together with a metal matrix, forming the grinding wheel.

Shape code
Conventional specification(mm)
D
T
H
X(W)
6A2T
220
65
130
5

6A2H
200
35
76
5
200
60
80
5
11A2
100
28.40
31.75,20
5
1A1
300
35
127
5,7,10
6B9H/C
300
50
48
10,20
6A2T/C
250
60
38.1
10,15
2022100106422199.jpg_看图王.web
Resin-Diamond-wheel-for-silicon-wafers-rough-grinding_看图王.web

 

Features of cylindrical grinding wheel for silicon ingot

1.Realizes a total-like cost cut by fast material removal
2.Minimal influence on crystalline structure
3.Low grinding load, good grinding performance and wear resistance
4.Ingot surface with a high flat degree.
5.Low dressing frequency

规格

Mainly used for flat grinding and chamfering of polycrystalline silicon; flat and cylindrical grinding monocrystalline silicon.

Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and gallium nitride.
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