1.Metal diamond grinding wheel is mainly used for back thinning of sapphire epitaxial wafers, silicon chips, gallium arsenide, and GaN chips in the LED industry. The back grinding wheel for LED substrate has been exported to many countries, with superior grinding performance and high cost-effectiveness.
2. Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.
3.Material of workpiece: Synthetic sapphire, SiC,single crystal silicon.
4.Grinders: SHUWA , NTS , WEC , GALAXY ,SPEEDFAM ,OKAMOTO.
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1.High precision of the ground workpiece and good surface quality
2.Good shape retention of the workpiece
3.High grinding efficiency
4.Low grinding force and low grinding temperature
