Application: Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
How to selection of the correct types of wafer dicing blades to cut materials ?
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
Advantages of Wafer Hub Dicing Saw Blades
High Precision Cutting – Ensures clean and accurate dicing with minimal chipping.
Superior Blade Rigidity – Reduces blade vibration for improved cutting stability.
Thin Kerf Design – Minimizes material loss and enhances yield.
Extended Blade Life – Optimized for durability and consistent performance.
Customizable Specifications – Available in different thicknesses, diameters, and grit sizes to match specific applications.
